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| MCP601/2/3/4 2.7V 5.5V CMOS * 2.7V 5.5V * * * * * * 2.8 MHz ( ) 230 A/ ( ) (CS): MCP603 Microchip Technology Inc. MCP601/2/3/4 ( ) (MCP601) (CS) (MCP603) (MCP602) (MCP604) CMOS 2.7V230 A 0.3V A/D MCP601 MCP602 MCP603 8 PDIPSOIC TSSOP MCP601 MCP601R 5 SOT23 MCP603 6 SOT-23 MCP604 14 PDIP SOIC TSSOP MCP601/2/3/4 2.7V 5.5V * - -40C +85C - -40C +125C * * * * * * * A/D PDA * * SPICE www.microchip.com * FilterLab(R) www.microchip.com MCP601 PDIP, SOIC, TSSOP NC 1 VIN- 2 VIN+ 3 VSS 4 8 NC 7 VDD 6 VOUT 5 NC VOUTA 1 VINA- 2 VINA+ 3 VSS 4 MCP602 PDIP, SOIC, TSSOP 8 VDD 7 VOUTB 6 VINB- 5 VINB+ MCP603 PDIP, SOIC, TSSOP NC 1 VIN- 2 VIN+ 3 VSS 4 8 CS 7 VDD 6 VOUT 5 NC MCP604 PDIP, SOIC, TSSOP VOUTA 1 VINA- 2 VINA+ 3 VDD 4 VINB+ 5 VINB- 6 VOUTB 7 14 VOUTD 13 VIND- 12 VIND+ 11 VSS 10 VINC+ 9 VINC- 8 VOUTC MCP601 SOT23-5 VOUT 1 VSS 2 VIN+ 3 4 VIN- 5 VDD MCP601R SOT23-5 VOUT 1 VDD 2 VIN+ 3 4 VIN- 5 VSS MCP603 SOT23-6 VOUT 1 VSS 2 VIN+ 3 6 VDD 5 CS 4 VIN- 2004 Microchip Technology Inc. DS21314F_CN 1 MCP601/2/3/4 1.0 VIN+, VINA+, VINB+, VINC+, VIND+ VIN-, VINA-, VINB-, VINC-, VIND- VDD VSS VOUT, VOUTA, VOUTB, VOUTC, VOUTD CS NC VDD - VSS ........................................................................ 7.0V .................................. VSS - 0.3V VDD + 0.3V ............................................................|VDD - VSS| .................................................................. ................................................................ 2 mA ............................................ 30 mA ....................................................... -65C +150C ............................................................................ +150C ESD (HBM; MM) ........................ 3 kV; 200V : DC : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 100 k VDD/2. DC ( ) VOS VOS VOS VOS/TA PSRR IB IB IB IOS ZCM ZDIFF VCMR CMRR AOL AOL 1: -2 -3 -4.5 -- 80 -- -- -- -- -- -- VSS-0.3 75 100 95 0.7 1 1 2.5 88 1 20 450 1 1013||6 1013||3 -- 90 115 110 +2 +3 +4.5 -- -- -- 60 5000 -- -- -- VDD-1.2 -- -- -- mV mV mV V/C dB TA = -40C +85C ( 1) TA = -40C +125C ( 1) TA = -40C +125C VDD = 2.7V 5.5V pA pA TA = +85C ( 1) pA TA = +125C ( 1) pA ||pF ||pF V dB dB dB VDD = 5.0V, VCM = -0.3V 3.8V RL = 25 k VDD/2, VOUT = 100 mV VDD - 100 mV RL = 5 k VDD/2, VOUT = 100 mV VDD - 100 mV RL = 25 k VDD/2, = 0.5V RL = 5 k VDD/2, = 0.5V RL = 25 k VDD/2, AOL 100 dB RL = 5 k VDD/2, AOL 95 dB VDD = 5.5V VDD = 2.7V VOL, VOH VSS+15 VOL, VOH VSS+45 VOUT VSS+100 VSS+100 VOUT ISC -- ISC -- VDD IQ 2.7 -- -- -- -- -- 22 12 -- 230 VDD-20 VDD-60 VDD-100 VDD-100 -- -- 5.5 325 mV mV mV mV mA mA V A IO = 0 YYWW=0408 SOT-23 TSSOP DS21314F_CN 2 2004 Microchip Technology Inc. MCP601/2/3/4 AC : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 100 k VDD/2, CL = 50 pF. (0.01%) Eni eni eni ini -- -- -- -- 7 29 21 0.6 -- -- -- -- VP-P f = 0.1 Hz 10 Hz nV/Hz f = 1 kHz nV/Hz f = 10 kHz fA/Hz f = 1 kHz SR tsettle -- -- 2.3 4.5 -- -- V/s s G = +1 V/V G = +1 V/V, 3.8V GBWP PM -- -- 2.8 50 -- -- MHz G = +1 V/V MCP603 : TA = +25C, VDD = +2.7V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 100 k VDD/2, CL = 50 pF. DC CS , CS , CS , CS , VSS CS CS CS High-Z tON tOFF -- -- 3.1 100 10 -- s ns CS 0.2VDD, G = +1 V/V CS 0.8VDD, G = +1 V/V, VIL ICSL VIH ICSH IQ_SHDN IO_SHDN HYST VSS -1.0 0.8 VDD -- -2.0 -- -- -- -- -- 0.7 -0.7 1 0.3 0.2 VDD -- VDD 2.0 -- -- -- V A V A A nA V CS = VDD CS = VDD CS = 0.2VDD CS tON VOUT IDD ISS CS Hi-Z 2 nA (typ.) 230 A ( ) tOFF Hi-Z -700 nA (typ.) -230 A ( ) 2 nA ( ) 700 nA (typ.) 1-1: MCP603 (CS) 2004 Microchip Technology Inc. DS21314F_CN 3 MCP601/2/3/4 : VDD = +2.7V +5.5V VSS = GND. , 5L-SOT23 , 6L-SOT23 , 8L-PDIP , 8L-SOIC , 8L-TSSOP , 14L-PDIP , 14L-SOIC , 14L-TSSOP JA JA JA JA JA JA JA JA -- -- -- -- -- -- -- -- 256 230 85 163 124 70 120 100 -- -- -- -- -- -- -- -- C/W C/W C/W C/W C/W C/W C/W C/W TA TA TA TA -40 -40 -40 -65 -- -- -- -- +85 +125 +125 +150 C C C C Note (TJ) 150C DS21314F_CN 4 2004 Microchip Technology Inc. MCP601/2/3/4 2.0 ( ) : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k VDD/2, VOUT VDD/2, CL = 50 pF 120 Open-Loop Gain (dB) 100 80 60 40 20 0 -20 -40 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 0 Open-Loop Phase (? Gain Phase -30 -60 -90 -120 -150 -180 -210 0.1 1 10 100 1k 10k 100k 1M 10M -240 Quiescent Current per Amplifier (A) 300 250 200 150 100 50 0 0. 0. 1. 1. 2. 2. 3. 3. 4. 4. 5. 5. 050505050505 Supply Voltage (V) IO = 0 -40C +25C +85C +125C Frequency (Hz) 2-1: 2-4: 300 Quiescent Current per Amplifier (A) 3.5 3.0 Slew Rate (V/s) 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 Falling Edge Rising Edge VDD = 5.0V 250 200 150 100 50 0 -50 -25 0 25 50 75 IO = 0 VDD = 5.5V VDD = 2.7V 100 125 Ambient Temperature (C) Ambient Temperature (C) 2-2: 2-5: 10 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 GBWP 110 100 90 80 70 60 50 40 30 20 10 0 10,000 Input Noise Voltage Density (V/Hz) Phase Margin, G = +1 () Gain Bandwidth Product (MHz) 1 1,000 PM, G = +1 100n 100 -50 -25 0 25 50 75 10 12 05 Ambient Temperature (C) 10n 0.1 10 1.E-01 1.E+00 1 10 1.E+01 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 1M 1.E+06 Frequency (Hz) 2-3: 2-6: 2004 Microchip Technology Inc. DS21314F_CN 5 MCP601/2/3/4 : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k VDD/2, VOUT VDD/2, CL = 50 pF 16% 14% 12% 10% 8% 6% 4% 2% 0% -2.0 -1.6 -1.2 -0.8 -0.4 0.0 0.4 0.8 1.2 1.6 2.0 Input Offset Voltage (mV) 18% 16% 1200 Samples 14% TA = -40 to +125C 12% 10% 8% 6% 4% 2% 0% -10 -8 -6 -4 -2 0 2 4 6 8 10 Input Offset Voltage Drift (V/C) 2-7: Percentage of Occurrences 2-10: Percentage of Occurrences 1200 Samples Input Offset Voltage (mV) 0.5 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 -50 -25 0 100 CMRR, PSRR (dB) VDD = 5.5V VDD = 2.7V 95 90 85 80 75 25 50 75 100 125 -50 -25 0 25 50 75 100 125 PSRR CMRR Ambient Temperature (C) Ambient Temperature (C) 2-8: 2-11: 800 700 600 500 400 300 200 100 0 -100 -200 CMRR, PSRR 800 700 600 500 400 300 200 100 0 -100 -200 Input Offset Voltage (V) Input Offset Voltage (V) VDD = 2.7V VDD = 5.5V TA = -40C TA = +25C TA = +85C TA = +125C TA = -40C TA = +25C TA = +85C TA = +125C TA = +125C -0.5 0.0 0.5 1.0 1.5 2.0 TA = +125C Common Mode Input Voltage (V) Common Mode Input Voltage (V) 2-9: (VDD = 2.7V) 2-12: (VDD = 5.5V) DS21314F_CN 6 2004 Microchip Technology Inc. MCP601/2/3/4 : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k VDD/2, VOUT VDD/2, CL = 50 pF Channel to Channel Separation (dB) 150 140 130 120 110 100 90 1.E+03 1.E+04 1.E+05 1.E+06 No Load CMRR, PSRR (dB) 100 90 80 70 60 50 40 30 20 VDD = 5.0V 10 100 1.E+00 1.E+01 PSRR+ PSRRCMRR 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1k 10k 100k Frequency (Hz) 1M 1k 10k Frequency (Hz) 100k 2-13: Input Bias and Offset Currents (pA) 1000 VDD = 5.5V VCM = 4.3V 2-16: Input Bias and Offset Currents (pA) 1000 CMRR, PSRR IB, +125C 100 VDD = 5.5V max. VCMR 4.3V 100 IB 10 IOS IB, +85C 10 IOS, +125C IOS, +85C 1 25 35 45 55 65 75 85 95 105 115 125 Ambient Temperature ( ) 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Common Mode Input Voltage (V) 2-14: 120 DC Open-Loop Gain (dB) 2-17: 120 DC Open-Loop Gain (dB) RL = 25 k 110 100 90 80 110 VDD = 5.5V 100 VDD = 2.7V 90 80 100 1.E+02 1.E+03 1.E+04 1.E+05 1k 10k Load Resistance () 100k 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) 2-15: DC 2-18: DC 2004 Microchip Technology Inc. DS21314F_CN 7 MCP601/2/3/4 : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k VDD/2, VOUT VDD/2, CL = 50 pF 3.5 Gain Bandwidth Product (MHz) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 1.E+02 1.E+03 1.E+04 1.E+05 90 GBWP 80 70 60 PM, G = +1 50 40 1k 10k Load Resistance () 30 100k Phase Margin, G = +1 () DC Open-Loop Gain (dB) VDD = 5.0V 100 130 VDD = 5.5V, RL = 25 k 120 110 100 90 80 -50 -25 0 25 50 75 100 125 Ambient Temperature (C) VDD = 5.5V, RL = 5 k VDD = 2.7V, RL = 25 k VDD = 2.7V, RL = 5 k 2-19: 1,000 Output Headroom (mV); VDD - VOH and VOL - VSS 2-22: DC 1000 Output Headroom (mV); VDD - VOH and VOL - VSS VDD = 5.5V RL tied to VDD/2 VDD - VOH, RL = 5 k VOL - VSS, RL = 5 k 100 100 VDD-VOH VOL-VSS 10 10 VDD - VOH, RL = 25 k VOL - VSS, RL = 25 k 1 -50 -25 0 25 50 75 100 125 1 0.01 0.1 1 Output Current Magnitude (mA) 10 Ambient Temperature (C) 2-20: 10 Maximum Output Voltage Swing (VP-P) 2-23: Output Short Circuit Current Magnitude (mA) VDD = 5.0V 30 25 20 15 10 5 0 TA = -40C TA = +25C TA = +85C TA = +125C 1 0.1 10k 1.E+04 0. 0. 1. 1. 2. 2. 3. 3. 4. 4. 5. 5. 050505050505 Supply Voltage (V) 1.E+05 1.E+06 1.E+07 100k 1M 10M Frequency (Hz) 2-21: 2-24: DS21314F_CN 8 2004 Microchip Technology Inc. MCP601/2/3/4 : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k VDD/2, VOUT VDD/2, CL = 50 pF 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 . E+ 0 0 Output Voltage (V) 1 . E- 0 6 2 . E- 0 6 3 . E- 0 6 4 . E- 0 6 5 . E- 0 6 6 . E- 0 6 7 . E- 0 6 8 . E- 0 6 9. E- 0 6 1 . E- 05 Output Voltage (V) VDD = 5.0V G = +1 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 . E+ 0 0 1 . E- 0 6 2 . E- 0 6 3 . E- 0 6 VDD = 5.0V G = -1 4 . E- 0 6 5 . E- 0 6 6 . E- 0 6 7 . E- 0 6 8 . E- 0 6 9. E- 0 6 1 . E- 05 Time (1 s/div) Time (1 s/div) 2-25: 2-28: 2. 59 Output Voltage (20 mV/div) Output Voltage (20 mV/div) 2. 57 VDD = 5.0V G = +1 2. 59 2. 57 VDD = 5.0V G = -1 2. 55 2. 55 2. 53 2. 53 2. 51 2. 51 2. 49 2. 49 2. 47 2. 47 2. 45 2. 45 2. 43 2. 43 2. 41 2. 41 0 . E+ 0 0 1 . E- 0 6 2 . E- 0 6 3 . E- 0 6 4 . E- 0 6 5 . E- 0 6 6 . E- 0 6 7 . E- 0 6 8 . E- 0 6 9 . E- 06 1 . E- 05 0 . E+ 0 0 1 . E- 0 6 2 . E- 0 6 3 . E- 0 6 4 . E- 0 6 5 . E- 0 6 6 . E- 0 6 7 . E- 0 6 8 . E- 0 6 9 . E- 06 1 . E- 05 Time (1 s/div) Time (1 s/div) 2-26: 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 2-29: 0 VDD = 5.5V CS VDD = 5.0V G = +1 VIN = 2.5V RL = 100 k to GND VOUT Active -100 Quiescent Current through VSS () -200 -300 -400 -500 -600 -700 VOUT High-Z Output Voltage, Chip Select Voltage (V) -800 5.0E-05 0.0E+00 5.0E-06 1.0E-05 1.5E-05 2.0E-05 2.5E-05 3.0E-05 3.5E-05 4.0E-05 4.5E-05 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Chip Select Voltage (V) Time (5 s/div) 2-27: (MCP603) VSS 2-30: (MCP603) 2004 Microchip Technology Inc. DS21314F_CN 9 MCP601/2/3/4 : TA = +25C, VDD = +2.7V +5.5V, VSS = GND, VCM = VDD/2, RL = 100 k VDD/2, VOUT VDD/2 CL = 50 pF 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Chip Select Voltage (V) Time (5 s/div) Chip Select Pin Current () VDD = 5.5V (Input and Output Voltages (V) 6 5 4 3 2 1 0 -1 VDD = +5.0V G = +2 VIN VOUT 0 . 0E+0 0 5. 0E- 06 1. 0E- 0 5 1 . 5 E- 0 5 2 . 0 E- 0 5 2 . 5 E- 05 2-31: Internal Chip Select Switch Output Voltage (V) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 VDD = 5.0V 2-33: MCP601/2/3/4 Amplifier On CS Hi to Low CS Low to Hi Amplifier Hi-Z 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Chip Select Voltage (V) 2-32: DS21314F_CN 10 2004 Microchip Technology Inc. MCP601/2/3/4 3.0 3.3 MCP603 MCP601/2/3/4 Microchip CMOS MCP603 (CS) CS -0.7 A () CS VSS CS CS 1-1 CS CS 2-27 CS 3.1 MCP601/2/3/4 2-33 (VCMR) (VSS) VDD (VCM) (+25C VSS - 0.3V VDD - 1.2V) (+25C VSS - 0.3V VDD - 1.2V) 2 mA (RIN) 3-1 RIN VIN + 3.4 ( G=+1> 40 pF) ( 3-2 RISO) ( ) MCP60X - + MCP60X - RG RF RISO VOUT CL ( minimum expected V IN ) - V DD R IN ------------------------------------------------------------------------2 mA V SS - ( minimum expected VIN ) R IN -------------------------------------------------------------------------2 mA 3-2: RISO 3-1: RIN 3.2 3-3 RISO X (CL/GN) GN GN GN 1 + | |( -1 V/V GN = +2 V/V) MCP601/2/3/4 ( ) 25 k VDD/2 15 mV 2-33 (DC (AOL)) 100 mV 2004 Microchip Technology Inc. DS21314F_CN 11 MCP601/2/3/4 1. 1k Recommended RISO ( ) 1,000 2. 100 100 GN = +1 GN +2 (VIN-) ( ) (VIN+) ( VDD/2 ) 3.7 10 10p 10 10 100 1,000 10,000 100p 1n 10n Normalized Load Capacitance; CL / GN (F) 3.7.1 3-3: RISO RISO MCP601/2/3/4 SPICE RISO 3-5 3-6 10 Hz Butterworth 3-5 +1 V/V 3-6 -1 V/V G = +1 V/V fP = 10 Hz 3.5 C1 47 nF R2 R1 641 k 382 k VIN C2 22 nF ( VDD)(0.01 F0.1 F) 2 mm ( 1 F ) 100 mm + MCP60X VOUT - 3.6 PCB 3-5: Sallen-Key R2 618 k R3 R1 618 k 1.00 M VIN C2 47 nF VDD/2 C1 8.2 nF VOUT G = -1 V/V fP = 10 Hz (PCB) 1012 5V 5 pA MCP601/ 2/3/4 +25C(1 pA) ( ) 3-4 VIN- VIN+ + MCP60X - 3-6: 3-4: MCP601/2/3/4 PCB Microchip FilterLab(R) DS21314F_CN 12 2004 Microchip Technology Inc. MCP601/2/3/4 3.7.2 3.7.3 3-3 R2/RG V1 + MCP601/2/3/4 ( ) ( ) 3 (R2) 93-10 (C2) ( 3-9) ( ) C2 R2 ID1 - VDD VOUT MCP60X - R3 - R4 MCP60X RG - VOUT R2 R2 R3 + R4 MCP60X V2 + VREF Light D1 MCP60X + VOUT = ID1 R2 V OUT 2R 2 R 4 = ( V 1 - V 2 ) 1 + -------- ----- + V REF R G R 3 3-7: 3-9: 3-8 2 RG R1 VREF V2 V1 R 1 2R1 V OUT = ( V 1 - V 2 ) 1 + ----- + -------- + V REF R2 RG MCP60X + R2 R2 MCP60X + R1 ( 3-10) ( ) C2 R2 ID1 D1 VBIAS - VDD VOUT VOUT Light MCP60X + VOUT = ID1 R2 VBIAS < 0V 3-8: 3-10: 1 F CMRR CMRR 2004 Microchip Technology Inc. DS21314F_CN 13 MCP601/2/3/4 4.0 Microchip MCP601/2/3/4 4.1 SPICE (www.microchip.com) MCP601/2/3/4 SPICE SPICE 4.2 FilterLab(R) 2.0 FilterLab(R) 2.0 ( ) Microchip www.microchip.com FilterLab SPICE DS21314F_CN 14 2004 Microchip Technology Inc. MCP601/2/3/4 5.0 5.1 5 SOT-23 ( MCP601 MCP601R) : XXNN 04NN 6 SOT-23A ( MCP603) : XXNN 04NN : XX...X * YY ( ) WW ( `01') NNN Microchip : * OTP Microchip 2004 Microchip Technology Inc. DS21314F_CN 15 MCP601/2/3/4 8 PDIP (300 mil) : XXXXXXXX XXXXXNNN YYWW MCP601 I/P256 0424 8 SOIC (150 mil) : XXXXXXXX XXXXYYWW NNN MCP601 I/SN0324 256 8 TSSOP : XXXX XYWW NNN 601 I324 256 14 PDIP (300 mil) ( MCP604) : XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN MCP604-I/P XXXXXXXXXXXXXX 0424256 14 SOIC (150 mil) ( MCP604) : XXXXXXXXXXX XXXXXXXXXXX YYWWNNN MCP604ISL XXXXXXXXXXX 0424256 14 TSSOP (4.4mm) ( MCP604) : XXXXXXXX YYWW NNN 604I 0324 256 DS21314F_CN 16 2004 Microchip Technology Inc. MCP601/2/3/4 5 (OT) (SOT-23) E E1 p B p1 D n 1 c A A2 L A1 ( ) * n p p1 A A2 A1 E E1 D L c B * 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 5 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 5 0.15 0.43 5 5 .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 0.90 0.90 0.00 2.60 1.50 2.80 0.35 0 0.09 0.35 0 0 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 : D E1 . 0.010 (0.254 ) JEDEC : MO-178 . C04-091 2004 Microchip Technology Inc. DS21314F_CN 17 MCP601/2/3/4 6 (CH) (SOT-23) E E1 B P1 D n C A A2 L A1 * n p p1 A A2 A1 E E1 D L c B .035 .035 0 .102 .059 .110 .014 0 .004 .014 0 0 * 6 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 0.90 0.90 0.00 2.60 1.50 2.80 0.35 0 0.09 0.35 0 0 6 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 5 0.15 0.43 5 5 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 D E1 0.005O c ( 0 JEITA( EIAJ) SC-74A C04-120 .127 A A x ) DS21314F_CN 18 2004 Microchip Technology Inc. MCP601/2/3/4 8 (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B * n p A A2 A1 E E1 D L c B1 B eB * 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 8 2.54 3.94 3.30 7.94 6.35 9.46 3.30 0.29 1.46 0.46 9.40 10 10 .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 3.56 2.92 0.38 7.62 6.10 9.14 3.18 0.20 1.14 0.36 7.87 5 5 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 : D E1 . 0.010 (0.254 ) JEDEC : MS-001 C04-018 2004 Microchip Technology Inc. DS21314F_CN 19 MCP601/2/3/4 8 (SN) - , 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 * n p A A2 A1 E E1 D h L c B * 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 8 1.27 1.55 1.42 0.18 6.02 3.91 4.90 0.38 0.62 4 0.23 0.42 12 12 .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 1.35 1.32 0.10 5.79 3.71 4.80 0.25 0.48 0 0.20 0.33 0 0 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 : D E1 . 0.010 (0.254 ) JEDEC : MS-012 C04-057 DS21314F_CN 20 2004 Microchip Technology Inc. MCP601/2/3/4 8 (ST) - 4.4 mm (TSSOP) E E1 p 2 1 n B D A c L A1 A2 * n p A A2 A1 E E1 D L c B 8 .026 * 8 0.65 .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 0.85 0.05 6.25 4.30 2.90 0.50 0 0.09 0.19 0 0 0.90 0.10 6.38 4.40 3.00 0.60 4 0.15 0.25 5 5 1.10 0.95 0.15 6.50 4.50 3.10 0.70 8 0.20 0.30 10 10 : D E1 . 0.005 (0.127 ) JEDEC : MO-153 C04-086 2004 Microchip Technology Inc. DS21314F_CN 21 MCP601/2/3/4 14 (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c eB A1 B1 B p L 14 .100 A .140 .155 .170 3.56 A2 .115 .130 .145 2.92 A1 .015 0.38 E .300 .313 .325 7.62 .240 .250 .260 6.10 E1 D .740 .750 .760 18.80 L .125 .130 .135 3.18 c .008 .012 .015 0.20 B1 .045 .058 .070 1.14 B .014 .018 .022 0.36 eB .310 .370 .430 7.87 5 10 15 5 5 10 15 5 * : D E1 . 0.010 (0.254 ) JEDEC : MS-001 C04-005 n p * 14 2.54 3.94 3.30 7.94 6.35 19.05 3.30 0.29 1.46 0.46 9.40 10 10 4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15 DS21314F_CN 22 2004 Microchip Technology Inc. MCP601/2/3/4 14 (SL) - 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 * n p A A2 A1 E E1 D h L c B * 14 .050 .061 .056 .007 .236 .154 .342 .015 .033 4 .009 .017 12 12 14 1.27 1.55 1.42 0.18 5.99 3.90 8.69 0.38 0.84 4 0.23 0.42 12 12 .053 .052 .004 .228 .150 .337 .010 .016 0 .008 .014 0 0 .069 .061 .010 .244 .157 .347 .020 .050 8 .010 .020 15 15 1.35 1.32 0.10 5.79 3.81 8.56 0.25 0.41 0 0.20 0.36 0 0 1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 8 0.25 0.51 15 15 : D E1 . 0.010 (0.254 ) JEDEC : MS-012 C04-065 2004 Microchip Technology Inc. DS21314F_CN 23 MCP601/2/3/4 14 (ST) - 4.4 mm (TSSOP) E E1 p D 2 n B 1 A c L A1 A2 * n p A A2 A1 E E1 D L c B 14 .026 * 14 0.65 .033 .002 .246 .169 .193 .020 0 .004 .007 0 0 .035 .004 .251 .173 .197 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .201 .028 8 .008 .012 10 10 0.85 0.05 6.25 4.30 4.90 0.50 0 0.09 0.19 0 0 0.90 0.10 6.38 4.40 5.00 0.60 4 0.15 0.25 5 5 1.10 0.95 0.15 6.50 4.50 5.10 0.70 8 0.20 0.30 10 10 : D E1 . 0.005 (0.127 ) JEDEC : MO-153 C04-087 DS21314F_CN 24 2004 Microchip Technology Inc. MCP601/2/3/4 . X /XX : a) b) c) MCP601 MCP601T (SOT23, SOIC TSSOP ) MCP601RT (SOT23-5 ) MCP602 MCP602T (SOIC TSSOP ) MCP603 MCP603T (SOT23, SOIC TSSOP ) MCP604 MCP604T (SOIC TSSOP ) I E = -40C +85C = -40C +125C d) e) , 8 PDIP MCP601-E/SN: , 8 SOIC MCP601T-I/OT: , , 5 SOT23 MCP601T-E/ST: , , 8 TSSOP MCP601RT-E/OT: , , , 5 SOT23 MCP602-I/SN: MCP602-E/P: MCP602T-E/ST: , 8 SOIC , 8 PDIP , , 8 TSSOP , 8 SOIC , 8 PDIP , , 8 TSSOP , 8 SOIC , 14 PDIP , 14 SOIC , , 14 TSSOP MCP601-I/P: a) b) c) a) b) c) MCP603-I/SN: MCP603-E/P: MCP603T-E/ST: OT CH P SN SL ST = = = = = = SOT23, 5 ( MCP601) SOT23, 6 ( MCP603) DIP (300 mil ), 8, 14 SOIC (150 mil ), 8 SOIC (150 mil ), 14 d TSSOP (4.4mm ), 8, 14 d) MCP603T-I/SN: a) b) c) MCP604-I/P: MCP604-E/SL: MCP604T-I/ST: 1. 2. 3. Microchip Microchip 1-480-792-7277 Microchip (www.microchip.com) Microchip (www.microchip.com/cn) 2004 Microchip Technology Inc. DS21314F_CN 25 MCP601/2/3/4 : DS21314F_CN 26 2004 Microchip Technology Inc. Microchip * * * Microchip Microchip Microchip Microchip Microchip Microchip Microchip Microchip "" * * Microchip Microchip Digital Millennium Copyright Act Microchip Technology Inc. Microchip Microchip Microchip Microchip Accuron dsPIC KEELOQ MPLAB PIC PICmicro PICSTART PRO MATE PowerSmart rfPIC Microchip Technology Inc. AmpLab FilterLab microID MXDEV MXLAB PICMASTER rfPIC SEEVAL SmartShunt The Embedded Control Solutions Company Microchip Technology Inc. Application Maestro dsPICDEM dsPICDEM.net dsPICworks ECAN ECONOMONITOR FanSense FlexROM fuzzyLAB In-Circuit Serial Programming ICSP ICEPIC Migratable Memory MPASM MPLIB MPLINK MPSIM PICkit PICDEM PICDEM.net PICtail PowerCal PowerInfo PowerMate PowerTool rfLAB Select Mode SmartSensor SmartTelTotal Endurance Microchip Technology Inc. SQTP Microchip Technology Inc. (c) 2004, Microchip Technology Inc Microchip Chandler Tempe Mountain View 2003 10 ISO/TS-16949:2002 PICmicro(R) 8 KEELOQ(R) EEPROM ISO/TS-16949:2002 Microchip ISO 9001:2000 DS21314F_CN 27 2004 Microchip Technology Inc. Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 1- 480-792-7200 Fax: 1- 480-792-7277 Technical Support: 1-480-792-7627 Web Address: http://www.microchip.com Australia Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-22290061 Fax: 91-80-22290062 - 6 706B 100027 86-10-85282100 86-10-85282104 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 1-770-640-0034 Fax: 1-770-640-0307 - 88 2401-2402 610016 86-28-86766200 86-28-86766599 Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 1-978-692-3848 Fax: 1-978-692-3821 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 1-630-285-0071 Fax: 1-630-285-0075 - 71 28 F 350001 86-591-7503506 86-591-7503521 Singapore 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 1-972-818-7423 Fax: 1-972-818-2924 - 223 2 901-906 852-24011200 852-24013431 Austria Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 1-248-538-2250 Fax: 1-248-538-2260 - 317 B 701 200051 86-21-62755700 86-21-62755060 Denmark Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 Kokomo 2767 S. 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De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 02/17/04 Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 DS21314F_CN 28 2004 Microchip Technology Inc. |
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